Overclocker Delids AMD AM4 CPU

Overclocker Delids AMD AM4 CPU

| Source: Nam Dae Won Author: Mark Campbell

Overclocker Delids AMD AM4 CPU

The overclocker Nam Dae Won has Delidded an AMD AM4 CPU, revealing that the CPU uses solder or liquid metal as its thermal interface material.

Over the past few years deliding CPUs has been popular amongst overclockers, removing the IHS (integrated heat spreader) improve heat transfer between the CPU and your chosen cooling solution. This method has been particularly popular on Intel's LGA 115X series CPUs, which use thermal paste to connect their CPUs to the IHS instead of solder or other more thermally conductive materials.

It looks like AMD's AM4 CPUs will be using a high-quality thermal interface material, which means that mainstream users will likely see no benefit from de-lidding their CPUs.

We can also see that AMD's AM4 CPU will have a central cutout and have a total of 1331 pins, matching existing images of AMD's AM4 CPU socket. The CPU pictured is likely an AMD Bristol Ridge APU, rather than an AMD Zen-based Summit Ridge CPU.

According to MAXSUN, AMD's Zen CPU will first launch on January 17th with a secondary launch for additional (likely lower end) Zen CPUs in early March. This means that AMD is likely to officially reveal their Zen CPUs at CES 2017, which will take place between January 6th and January 8th.

You can join the discussion on AMD's AM4 CPUs using high-quality thermal interface material on the OC3D Forums.

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